== Erch E-book Expedition ==

Geraldine C. Schwartz, Kris V. Srikrishnan, "Handbook of Semiconductor Interconnection Technology, Second Edition"
CRC; 2nd edition (February 22, 2006) | English | 1574446746 | 512 pages | PDF | 11.79 MB

First introduced nearly a decade ago, the first edition of the Handbook of semiconductor interconnection technology became very popular for its comprehensive and integrated treatment of interconnection technologies and future prospects. The field has grown enormously in the interim, many of the "addresses likely" is included in the first edition are now standard in modern facilities. Completely updated to reflect recent advances, this second edition examines the interconnection and manufacturing technologies available along with future prospects for the field.

What's New in the Second Edition?

• Detailed discussion of electrochemical equipment for plating copper
• Update on the tools used for evaporation, chemical vapor deposition and plasma processes
• Emphasis on measurement of mechanical and thermal properties of insulators
• Recently reported methods for characterizing porous dielectric thin films
• Closer attention to integration issues and properties of titanium, cobalt and nickel silicides
• Regimes new process based on the growing need for borderless contact gates and source / drain
• Discussion on options · recently extended to low dielectric insulators
• More emphasis on copper galvanized, especially the morphology of gold-plated films and their properties
• Recent developments in thin film coatings and barriers
• Expanded material on the reliability of copper

The Handbook of Semiconductor Interconnection Technology, Second Edition provides comprehensive coverage of the practical aspects of interconnections for manufacturing.